HTELabs THIN FILM DEPOSITIONS
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| RESISTIVE FILMS | High stability, Laser trim able, Low TCR |
| NiCr | 5, 10, 25,...200, 300, 400 ohms/sq, +/-10 to +/-100ppm/degC |
| TaN2 | 25,50,500,1000, to 2500 ohms/sq, +/-5 to +/-150ppm/degC |
| SiCr | 0.5K, 1K, 2.5K, 5K, 10k, 20K ohms/sq, +/-10 to +/-200ppm/degC |
| DIFFUSION BARRIER METALS | Ni, Mo, Pt, Pd, Ta, Ti, TiW, TiNx, TiW:Nx..... |
| ADHESION LAYERS | Cr, Mo, Ni, NiCr, Si, Ti, TiW, TiNx.... |
| CONDUCTIVE LAYERS | Al, Au, beta-Ta, Cu, Ni, Sn, SnPb, Zr... |
| NITRIDE AND OXIDE FILMS | AlN, Fe2O3, Si3N4 |
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